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Power chips are linked to exterior circuits through packaging, and their performance depends upon the assistance of the packaging. In high-power circumstances, power chips are generally packaged as power components. Chip affiliation refers to the electric link on the upper surface area of the chip, which is generally aluminum bonding wire in standard modules. ^
Standard power module package cross-section

At present, commercial silicon carbide power modules still primarily make use of the packaging modern technology of this wire-bonded typical silicon IGBT module. They deal with issues such as big high-frequency parasitic parameters, inadequate warmth dissipation capacity, low-temperature resistance, and insufficient insulation strength, which restrict the use of silicon carbide semiconductors. The display screen of excellent efficiency. In order to resolve these troubles and totally make use of the big prospective advantages of silicon carbide chips, many brand-new product packaging innovations and remedies for silicon carbide power modules have actually emerged in recent times.

Silicon carbide power module bonding method

(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)

Bonding materials have actually created from gold cord bonding in 2001 to aluminum cable (tape) bonding in 2006, copper wire bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold cords to copper cords, and the driving force is price reduction; high-power gadgets have developed from light weight aluminum wires (strips) to Cu Clips, and the driving force is to boost item performance. The higher the power, the greater the needs.

Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging procedure that uses a strong copper bridge soldered to solder to link chips and pins. Compared to typical bonding product packaging techniques, Cu Clip technology has the complying with advantages:

1. The link between the chip and the pins is made from copper sheets, which, to a specific degree, changes the standard cord bonding technique between the chip and the pins. Therefore, an one-of-a-kind package resistance value, higher existing flow, and much better thermal conductivity can be acquired.

2. The lead pin welding area does not require to be silver-plated, which can completely conserve the expense of silver plating and bad silver plating.

3. The item appearance is entirely constant with typical products and is mainly made use of in web servers, mobile computer systems, batteries/drives, graphics cards, electric motors, power supplies, and various other areas.

Cu Clip has 2 bonding techniques.

All copper sheet bonding method

Both eviction pad and the Resource pad are clip-based. This bonding technique is extra pricey and complex, yet it can achieve better Rdson and better thermal effects.

( copper strip)

Copper sheet plus wire bonding method

The source pad uses a Clip method, and eviction makes use of a Wire method. This bonding approach is somewhat less expensive than the all-copper bonding technique, saving wafer location (suitable to really little gateway areas). The procedure is less complex than the all-copper bonding method and can get better Rdson and better thermal impact.

Distributor of Copper Strip

TRUNNANO is a supplier of surfactant with over 12 years experience in nano-building energy conservation and nanotechnology development. It accepts payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are finding basic copper, please feel free to contact us and send an inquiry.

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